Product Features
- Superb performace, maximizing the heat trasfer between the heatsink and processor.
- Thermal Conductivity of 11.2 W/m-°C
- Thermal Impedance of 0.013°C-in2/W
- Excellent long term stability with low dry-out. High thermal conductivity with low thermal impedance. Non-corrosive and electrically non-conductive. No burn-in time required.
- One 5 gram syringe and easy-to-spread applicator.
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