Superb performace, maximizing the heat trasfer between the heatsink and processor.
Thermal Conductivity of 11.2 W/m-°C
Thermal Impedance of 0.013°C-in2/W
Excellent long term stability with low dry-out. High thermal conductivity with low thermal impedance. Non-corrosive and electrically non-conductive. No burn-in time required.
