Product Features
- Maximum COMPATIBILITY: compact size structure gives users greater flexibility in selecting chassis
- Patented VGF (Vortex generator Flow) to increase air convection around the heat pipes
- Unique air path creating high VEF (Vacuum Effect) to optimize the airflow
- Hdtv (heat-pipe direct touch) technology ensures rapid thermal Conduction and eliminates CPU hot spots quickly
- Cpu support: Intel LGA 775/1150/1151/1155/1156/1366, AMD AM4/AM3/AM3+/AM2/AM2+/FM1/FM2/FM2+; 130W TDP cooling capacity. Air flow - 32.8 CFM. Noise level - 24.5 decibels
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