Product Features
- Small in size with height of 137mm, using 92mm fan
- Powerful performance, compact fin design + powerful fan makes it capable to support chipsets up to TDP 130W.
- Off-center heatsink structure to avoid interference with RAM.
- 4*Ф6 mm heat pipes directly in contact with CPU, absorbing and dissipating the heat more efficiently.
- Special back plate bracket and metal adapter frame makes the mounting easy and structure strong.
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